| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a jointing method for components of an electronic component realizing a short thin and compact shape while accurately offering high productivity at a low cost, and also to provide an electronic component using it. <P>SOLUTION: A double-faced tape 60 with heat resistance allowing space-saving jointing in joining a metal component 20 and resin component 50 etc. of the electronic component 1 and reflow soldering to a circuit board is used to substantially reduce time and effort required for jointing. With stable thickness C of the double-faced tape 60, most of variations in the size and the bonding strength after joining are eliminated. Short thin and compact shape of the electronic component 1 is thereby realized while accurately providing high productivity at a low cost. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
