SUBSTRATE ASSEMBLING APPARATUS

摘要

PURPOSE: A substrate bonding device is provided to chuck the substrate with various sizes by individually driving a plurality of upper electrostatic chuck units. CONSTITUTION: An upper table(200) and a lower table(300) are arranged in a chamber to face each other. A plurality of upper electrostatic chuck units(400) are mounted in a lower surface of the upper table. The plurality of power controllers(500) supply the power to the upper electrostatic chuck units respectively. At least one lower electrostatic chuck unit(600) is mounted on the upper surface of the lower table.