MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a printed circuit board is provided to improve a cohesive force and a print by using a commercial ink after an electroless copper plating step. CONSTITUTION: An inner layer circuit is formed on an insulation substrate(S350). A solder mask is formed on a cavity part of the inner layer circuit(S360). An adhesive prepreg is laminated on a surface of the insulation substrate except for the solder mask(S370). A copper clad laminate plate is laminated. In the copper clad laminate plate, a part corresponding to the cavity part through the prepreg is opened(S375). An electroless copper plating is performed in both surfaces of the insulation substrate in order to be connected to the inner layer circuit(S380). A copper plating resist is coated in the cavity part of the insulation substrate(S390). An electrolysis copper plating is performed in a top surface of the electroless copper plating except for a part in which the copper plating resist is coated(S400). An outer layer circuit is formed on the insulation substrate by pattering the electroless copper plating and the electrolysis copper plating(S410). The copper plating resist is peeled off(S420). The electroless copper plating of the cavity part is removed(S430).