| 摘要 |
PURPOSE: A sawing device for manufacturing a semiconductor package is provided to perform a sawing operation by moving a cutting blade to another sawing process part after the sawing operation is completed by the cutting blade in one sawing process part. CONSTITUTION: A sawing device for manufacturing a semiconductor package includes a first sawing process part(41), a second sawing process part(45), a cutting blade(50), and a cleaning nozzle unit(60). The first sawing process part and the second sawing process part include a first chuck table(42) and a second chuck table(46) in which a sawing process strip is fixed. The cutting blade is movably installed in an upper side of the first sawing process part and the second sawing process part. The cutting blade saws the strip on the first and second chuck tables with a semiconductor package unit. The cleaning nozzle unit is installed in the upper side of the first and second sawing process parts. The cleaning nozzle unit sprays the fluid to the first and second chuck tables.
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