MULTILAYER PRINTED CIRCUIT BOARD AND A FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A multilayer printed circuit board and a method for manufacturing the same are provided to increase productivity by forming a build-up layer in both sides and attaching a pair of insulation support layers. CONSTITUTION: A build-up layer(108) includes a plurality of circuits(109) and a plurality of insulation layers(111). An insulation resin layer(101) is formed in the outermost circuit layer(105) in one side of the build-up layer printed with a bump(103). A solder resist layer(112) is formed in the outermost layer of the other side of the build-up layer. The bump passes through the insulation resin layer and is protruded.