| 摘要 |
<p>Disclosed is a dicing die-bonding film which has an excellent balance between a holding force during the dicing of a work and detachability upon the detachment of a chip-type work produced by the dicing together with the die-bonding film even when the work is thin. Disclosed is a dicing die-bonding film which comprises a base material, a dicing film arranged on the base material and having an adhesive layer, and a die-bonding film arranged on the dicing film, wherein the adhesive layer comprises: a polymer which is produced by the addition reaction of 10 to 30 mol% of a acrylic polymer containing a hydroxyl-containing monomer with 70 to 90 mol% (relative to the amount of the hydroxyl-containing monomer) of an isocyanate compound having a radical-reactive carbon-carbon double bond; and a crosslinking agent which has two or more functional groups each reactive to a hydroxyl group in its molecule and which is contained in an amount of 2 to 20 parts by weight relative to 100 parts by weight of the polymer, and wherein the die-bonding film comprises an epoxy resin.</p> |
