| 摘要 |
A polishing apparatus is provided with a polishing tape having a polishing surface; a substrate holding section for rotating the substrate (W) by holding the substrate; a pressurizing pad (50) for pressing the polishing tape to a bevel section of the substrate held by the substrate holding section; and a polishing tape feeding mechanism for advancing the polishing tape in the longitudinal direction of the tape. The pressurizing pad (50) is provided with a pad main body (53); a board-like pressing section (51) having a pressing surface (51a) for pressing the bevel section of the substrate through the polishing tape, and a rear surface (51b) positioned on the opposite side to the pressing surface; and a plurality of connecting sections (52) for connecting the pressing section and the pad main body. The pressing section is formed of a hard plastic, and a space (S) is formed between the rear surface of the pressing section and the pad main body section.
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