发明名称 |
STRUCTURE AND METHOD FOR FABRICATION OF A LEADLESS MULTI-DIE CARRIER |
摘要 |
One disclosed embodiment comprises a substrate having a top surface for receiving two or more semiconductor dies. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of the substrate and at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of a first semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a first substrate bond pad and the printed circuit board. The first substrate bond pad is connected to the first signal bond pad of the first semiconductor die by a first signal bonding wire. The at least one via also provides an electrical connection between the first signal bond pad of the first semiconductor die and a first land that is electrically connected to the printed circuit board. |
申请公布号 |
EP1407641(A4) |
申请公布日期 |
2010.05.12 |
申请号 |
EP20020742334 |
申请日期 |
2002.06.27 |
申请人 |
SKYWORKS SOLUTIONS, INC. |
发明人 |
HASHEMI, HASSAN, S.;COTE, KEVIN, J. |
分类号 |
H01L23/12;H01L23/367;H01L23/36;H01L23/498;H01L23/64;H01L25/04;H01L25/065;H01L25/18 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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