发明名称 |
Low-temperature recoverable electronic component |
摘要 |
<p>An electronic component includes a base insulative layer 10 having a first surface 12 and a second surface 14; an electronic device 18 having a first surface 22 and a second surface 24, and the electronic device being secured to the base insulative layer; an adhesive layer 16 disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer 26 disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer releases the base insulative layer from the electronic device at a sufficiently low temperature.</p> |
申请公布号 |
EP2184774(A1) |
申请公布日期 |
2010.05.12 |
申请号 |
EP20080168413 |
申请日期 |
2008.11.05 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
FILLION, RAYMOND ALBERT;MILLS, RYAN CHRISTOPHER |
分类号 |
H01L21/58;H01L21/60 |
主分类号 |
H01L21/58 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|