发明名称 Hermetischer Deckel und seine Herstellung
摘要 A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au-Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni-Sn ally layer disposed between the Ni plating layer and the Au-Sn brazing material layer. It is preferable if the Ni-Sn alloy layer has a thickness of 0.6-5.0µm. It is also preferable if Au-Sn brazing material layer has a Sn content of 20.65-23.5wt%.
申请公布号 DE602005020216(D1) 申请公布日期 2010.05.12
申请号 DE20056020216T 申请日期 2005.05.19
申请人 TANAKA KIKINZOKU KOGYO K.K. 发明人 MIYAZAKI, KENICHI;KUSAMORI, HIROYUKI
分类号 H01L23/04;H01L21/50;H01L23/10 主分类号 H01L23/04
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