发明名称 |
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE |
摘要 |
Disclosed is a positive-type photosensitive resin composition comprising (A) a phenolic resin modified with a compound having an unsaturated hydrocarbon group and having 4 to 100 carbon atoms, (B) a compound capable of generating an acid upon being irradiated with light, (C) a thermal crosslinking agent, and (D) a solvent. The positive-type photosensitive resin composition can be developed with an aqueous alkali solution, and which enables to form a resist pattern having excellent adhesiveness and good thermal impact resistance with a sufficiently high degree of sensitivity and at a high resolution. |
申请公布号 |
KR20100049687(A) |
申请公布日期 |
2010.05.12 |
申请号 |
KR20107007272 |
申请日期 |
2008.11.07 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MATSUTANI HIROSHI;UENO TAKUMI;NICOLAS ALEXANDRE;NANAUMI KEN |
分类号 |
G03F7/039;G03F7/022;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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