Verfahren zum Herstellen von Zinnschichten oder Zinnlegierungsschichten auf Draht aus Kupfer oder Kupferlegierungen durch Feuerverzinnen

摘要

The invention relates to a method and a device for tin plating copper jump wires. The copper wire passes a tin bath and is guided through a profiled stripping nozzle. Following the tin plating, the copper wire is passed through at least one stretching stage wherein the diameter of the copper wire is reduced by pulling. This method affords a simple way of producing tin plated wires of small diameter. The tearing of wires with small diameter during the tin plating process is eliminated and the expensive production of profiled stripping nozzles with small bore diameters is avoided. The copper wires which are tin plated according toe the present invention have a uniform tin layer of a thickness >3 mu m and are extremely solderable.