发明名称 |
WAFER JOINING METHOD, WAFER ASSEMBLAGE, AND CHIP |
摘要 |
<p>A method for joining a first wafer to at least a second wafer. The method is characterized by the following operations of depositing a sinterable bonding material on at least one of the wafers, joining the wafers, and sintering the bonding material by heating. Furthermore, a wafer composite and a chip are also described.</p> |
申请公布号 |
EP2183185(A2) |
申请公布日期 |
2010.05.12 |
申请号 |
EP20080774763 |
申请日期 |
2008.07.04 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
DONIS, DIETER;KOENIG, JENS |
分类号 |
B81C1/00;H01L21/20;H01L23/10 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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