ANISOTROPIC CONDUCTIVE FILM AND ITS PRODUCTION METHOD, AND BONDED BODY EMPLOYING ANISOTROPIC CONDUCTIVE FILM

摘要

An anisotropic conductive film ensuring excellent conduction reliability when an electronic component and a substrate are connected by restraining fluidity of conductive particles and thereby assuring high particle capture rate, and a bonded body of an electronic component and a substrate exhibiting high particle capture rate and excellent conduction reliability by using the anisotropic conductive film. The anisotropic conductive film contains a single layer of conductive particles arranged in a resin film on one surface side in the thickness direction thereof, and the ten point average of the distance between the one surface in the thickness direction of the resin film and the center of the conductive particle is 9μm or less. The bonded body is obtained by electrically bonding two or more kinds of members selected from electronic components and substrates through the anisotropic conductive film.