| 摘要 |
A leadframe structure for an electronic package is provided, wherein the leadframe structure comprises a die-pad, a barrier area, and a bonding area, wherein the barrier area is arranged between the die-pad and the bonding area, and wherein the barrier area is adapted to electrically connect the die-pad and the bonding area, and is further constructed in such a way that delamination growth between the leadframe structure and a moulding compound fixable to the leadframe structure is reduced. |
