发明名称 THERMAL EXPANSION COMPENSATION FOR MODULAR PRINTHEAD ASSEMBLY
摘要 The present invention relates to a printhead assembly for a printer. The assembly includes a support member. A plurality of printhead modules is mounted to the support member. Each printhead module includes an integrated circuit manufactured using micro-electromechanical systems (MEMS) techniques. The printhead modules are configured to move into alignment with each other upon heating of the printhead assembly.
申请公布号 EP1263594(B1) 申请公布日期 2010.05.12
申请号 EP20010911259 申请日期 2001.03.09
申请人 SILVERBROOK RESEARCH PTY. LIMITED 发明人 SILVERBROOK, KIA
分类号 B41J2/14;B41J2/16 主分类号 B41J2/14
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