| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a prepreg which does not reduce migration characteristics, heat resistance to reflow soldering and the like and excel in surface smoothness and causes hardly any generation of a resin powder. SOLUTION: A method of manufacturing a prepreg comprises providing a <=10μm - thick adhesive layer having, as the major component, an elastomer having a number average molecular weight of 100,000-1,000,000, a content of extracted ionic impurities of <=100 ppm, and a volume resistivity of >=107Ω.cm on at least one side of a prepreg by the transfer process.</p> |
