| 摘要 |
PURPOSE: An insulation cooling structure is provided to satisfy the safety requirement like the heat conduction and leakage prevention by forming a case using insulating materials. CONSTITUTION: An insulation cooling structure of an electronic component comprises an electric component(1), a heat-sink(2), a case(3), and fluid. The heat-sink is attached to the electric component. The heat-sink is made of thermal conduction materials. The case is made of insulating materials. A hollow part is formed inside the case. The case has a first storing groove. The heat-sink is combined in the first storing groove. The fluid is filled in the hollow part of the case. The fluid executes cooling, heat dissipation, and heat conduction. |
