发明名称 |
VARIOUS STRUCTURE/HEIGHT BUMPS FOR WAFER LEVEL-CHIP SCALE PACKAGE |
摘要 |
A die comprising: a substrate; two or more various shaped bump structures having a solder line formed over the substrate; and an epoxy layer formed over the substrate. The epoxy layer having a top surface wherein: (a) the solder lines are below the top surface of the epoxy layer'; (b) the solder lines are above the top surface of the epoxy layer; or (c) some of the solder lines are below the top surface of the epoxy layer and some of the solder lines are above the top surface of the epoxy layer. |
申请公布号 |
EP1704594(A4) |
申请公布日期 |
2010.05.12 |
申请号 |
EP20040809235 |
申请日期 |
2004.12.17 |
申请人 |
ADVANPACK SOLUTIONS PTE LTD |
发明人 |
CH'NG, HAN SHEN;LIM, ENG HAN MATTHEW |
分类号 |
H01L23/488;H01L21/56;H01L23/29;H01L23/31;H01L23/48;H01L23/485;H01L23/60;H01L25/065 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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