SEMICONDUCTOR CHIP HAVING ALIGN HOLE AND A MANUFACTURING METHOD FOR THE SAME

摘要

PURPOSE: A semiconductor chip including an alignment hole and a method for manufacturing the same are provided to improve the electro connection performance between the semiconductor chip and a printed circuit board by forming the alignment hole with location information of an external connection bump. CONSTITUTION: An external connection bump(130) is formed on one side of a semiconductor chip(100A). The external connection bump draws the signal of an electronic circuit which is integrated to the semiconductor chip. An alignment hole(102B) passes through the semiconductor chip and includes the location information of the external connection bump. The alignment hole is formed on the center of the semiconductor chip.