发明名称 |
Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |
摘要 |
A primer composition comprising an alkoxysilyl-containing polyamide-imide resin, an epoxy resin, a curing promoter, and an organic solvent forms a cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor members.
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申请公布号 |
US7714080(B2) |
申请公布日期 |
2010.05.11 |
申请号 |
US20060357988 |
申请日期 |
2006.02.22 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
AKIBA HIDEKI;SHIOBARA TOSHIO |
分类号 |
C08L63/00;C08G77/04;H01L21/00 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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