发明名称 Method for fabricating an attenuated phase shift photomask by separate patterning of negative and positive resist layers with corresponding etching steps for underlying light-shielding and phase shift layers on a transparent substrate
摘要 A method for fabricating a photomask includes the steps of forming a phase shift layer, a light-shielding layer, and a negative resist layer in that order on a transparent substrate, forming a first resist pattern including a pattern corresponding to a transfer pattern by performing first exposure and development on the negative resist layer, forming a light-shielding pattern by etching the light-shielding layer using the first resist pattern as a mask, removing the first resist pattern, and then forming a positive resist layer thereon, forming a second resist pattern including a pattern corresponding to a light-absorbing pattern by performing second exposure and development on the positive resist layer, and forming a phase shift pattern by etching the phase shift layer using the second resist pattern as a mask.
申请公布号 US7713664(B2) 申请公布日期 2010.05.11
申请号 US20060367280 申请日期 2006.03.06
申请人 FUJITSU MICROELECTRONICS LIMITED 发明人 ISHIWATA NAOYUKI
分类号 G03F1/32;G03F1/54;G03F7/11;G03F7/40;G03F9/00 主分类号 G03F1/32
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