| 摘要 |
A piezoelectric/electrostrictive film is formed on a solid-phase support, the piezoelectric/electrostrictive film including an incompletely bonded region which is incompletely bonded in a predetermined pattern to the solid-phase support, and a bonded region which is bonded to the surface of the solid-phase support so that the incompletely bonded region can be separated. The piezoelectric/electrostrictive film is bonded to a substrate and is separated from the solid-phase support in the bonded region. As a result, the incompletely bonded region is transferred to the substrate. The transferred incompletely bonded region is used as a piezoelectric/electrostrictive film for manufacturing a piezoelectric/electrostrictive film device. |
