METHOD OF MANUFACTURING PROBE UNIT FOR BONDING PROBE

摘要

PURPOSE: A method for manufacturing a probe unit for bonding a probe is provided to reduce a manufacturing cost by forming an interconnection unit in the probe in order to bond the probe to a substrate. CONSTITUTION: A conductive plate including a plate unit based on a conductive material and a recess unit which is recessed from the plate unit is prepared(S110). A probe is formed on the plate unit(S120). An opening which passes through the recess unit is formed(S130). The recess unit is formed on the plate unit into an island shape. The probe includes an interconnection unit.