A PRINTED CIRCUIT BOARD COMPRISING A BUMP-SUBSTRATE AND A METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board with a bump substrate and a manufacturing method thereof are provided to reduce the manufacturing time and costs of under fill by performing the functions of under fill through charged insulating material among bump patterns. CONSTITUTION: A bump pattern(150) projected to the upper part of a supporting unit is formed on a metallic board. Insulating material(300) is laminated on the upper part of the supporting unit to charge the spaces between the bump patterns. The supporting unit is patterned so that the bump patterns insulate each other. A bump substrate is manufactured by forming a connection pattern(175) which is one with the bump pattern. A build-up layer(600) with a circuit layer which electronically connects to the connection pattern is formed on the lower side of the bump substrate.