发明名称 |
Sputter targets and methods of manufacturing same to reduce particulate emission during sputtering |
摘要 |
Methods for reducing inclusion content of sputter targets and targets so produced are disclosed. Inclusions may be reduced by adding a small amount of Si to the molten Al or molten Al alloy followed by filtering of the molten metals through a filter medium. Targets having substantially no inclusions therein of greater than about 400 μm are especially useful in the sputtering of large flat panel displays and result, upon sputtering, in a reduction in the amount of macroparticles sputtered onto the substrate.
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申请公布号 |
US7712514(B2) |
申请公布日期 |
2010.05.11 |
申请号 |
US20080315205 |
申请日期 |
2008.12.01 |
申请人 |
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发明人 |
WICKERSHAM, JR. CHARLES E.;POOLE JOHN E.;LEYBOVICH ALEXANDER;ZHU LIN |
分类号 |
B22D1/00;C22B21/06;C22C21/02;C22C21/14;C23C14/34;C23C14/56 |
主分类号 |
B22D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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