METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a PCB is provided to prevent the alignment fault of a metal pattern by forming the metal pattern through a mask pattern. CONSTITUTION: A metal layer(20) is formed in a first side and a second side of an insulating substrate(10). A mask pattern is formed on the metal layer. A metal pattern(40) is selectively formed on the metal layer by using the mask pattern. The metal pattern is pressurized within the insulating substrate in order to be buried. The metal layer is removed from the first side and the second side of the insulating substrate. The metal layer and the metal pattern are made of the copper material. An adhesive film(11) is formed in the edge part of the insulating substrate in order to reinforce the adhesive force between the metal layer and the insulating substrate.