发明名称 Method for measuring dopant concentration during plasma ion implantation
摘要 Embodiments of the invention generally provide methods for end point detection at predetermined dopant concentrations during plasma doping processes. In one embodiment, a method includes positioning a substrate within a process chamber, generating a plasma above the substrate and transmitting a light generated by the plasma through the substrate, wherein the light enters the topside and exits the backside of the substrate, and receiving the light by a sensor positioned below the substrate. The method further provides generating a signal proportional to the light received by the sensor, implanting the substrate with a dopant during a doping process, generating multiple light signals proportional to a decreasing amount of the light received by the sensor during the doping process, generating an end point signal proportional to the light received by the sensor once the substrate has a final dopant concentration, and ceasing the doping process.
申请公布号 US7713757(B2) 申请公布日期 2010.05.11
申请号 US20080049047 申请日期 2008.03.14
申请人 APPLIED MATERIALS, INC. 发明人 FOAD MAJEED A.;LI SHIJIAN
分类号 H01L21/66;C23C16/44;C23F1/08 主分类号 H01L21/66
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