发明名称 Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
摘要 The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.
申请公布号 US7713340(B2) 申请公布日期 2010.05.11
申请号 US20040586379 申请日期 2004.11.11
申请人 NIPPON MINING & METALS CO., LTD. 发明人 KAWAMURA TOSHIFUMI;SUZUKI JUN;IMORI TORU
分类号 C23C18/28;C23C18/18 主分类号 C23C18/28
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