| 摘要 |
To provide a method of segmenting a semiconductor wafer, which is capable of preventing chippings. A semiconductor wafer 1 is partitioned into a circumferential ring-shaped region 1a and a segmentation region placed in the inner side of the ring-shaped region 1a. The semiconductor wafer 1 included in the segmentation region is cut into the form of a lattice along a plurality of perpendicular cutting lines 4 and is segmented into a plurality of chips 2. On the other hand, the semiconductor wafer 1 included in the ring-shaped region 1a is cut along two partition lines 5 extending in parallel to the cutting lines 4 from the center O of the semiconductor wafer 1 and is partitioned into four independent regions.
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