METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY

摘要

PURPOSE: A method and a device for injecting chemical mechanical polishing(CMP) slurry are provided to improve the accuracy of the slurry injection by directly injecting the slurry into a land region which passes below a wafer. CONSTITUTION: A concave trailing edge(12) of an injector(10) is comforted to the size and the shape of the leading edge of a polishing head. The injector is placed on a polishing pad(26). The lower surface of the injector faces to the polishing pad. CMP slurry is injected through an opening on the upper side of the injector. The CMP slurry is moved to the lower side of the injector through a channel or a reservoir(22). The CMP slurry is outlet through a plurality of openings on the lower side of the injector.