发明名称 |
METHOD FOR MAANUFACTURIG PCB AND PCB MANUFACTURED USING THE SAME |
摘要 |
PURPOSE: A method for manufacturing a printed circuit board and the printed circuit board manufactured thereby are provided to easily control thickness, shape, and size of a contact circuit using a metal or non-metal material. CONSTITUTION: A copper clad laminate(31) is formed by laminating a copper foil(31b) on a substrate insulator(31a). A dry film is laminated on the copper clad laminate. The external circuit is formed by striping the dry film after etching the copper foil. An insulation layer is formed between the external circuits. A gold plating layer is formed on the external circuit. A solder is coated on the external circuit. A contact circuit is attached to the solder. The contact circuit is bonded with the solder by a soldering device.
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申请公布号 |
KR100957418(B1) |
申请公布日期 |
2010.05.11 |
申请号 |
KR20090057416 |
申请日期 |
2009.06.26 |
申请人 |
SON, KYUNG AI;KANG, SUNG WON |
发明人 |
SON, KYUNG AI;KANG, SUNG WON |
分类号 |
H05K3/06;H05K3/18;H05K3/34;H05K3/40 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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