发明名称 Microneedle array device and its fabrication method
摘要 A microneedle array device and its fabrication method are provided. The microneedle array device comprises a supporting pad and a plurality of microneedles. Each microneedle has a top portion with a via thereon, thereby the microfluid may flow in or out. The intersection between the top portion and the inner tube of a microneedle forms a convex needle structure, and is almost perpendicular to the upper surface. For each microneedle, a hollow closed tube is formed between the top portion and the supporting pad. The fabrication method uses substrates with high transmittance and a plurality of convex area thereon as upper and lower caps, and applies a photolithography process to fabricate a microneedle array mold. It then sputters or electroplates metal material on the mold. The microneedle array is formed after having taken off the mold.
申请公布号 US7712198(B2) 申请公布日期 2010.05.11
申请号 US20070754368 申请日期 2007.05.29
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 KUO SHIH-CHI;CHOU YU-KON
分类号 B23B37/00 主分类号 B23B37/00
代理机构 代理人
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