| 发明名称 |
Copper oxide thin film low-friction material and film-forming method therefor |
| 摘要 |
A copper oxide thin film mainly containing CuO is formed by a plasma film-forming process on a substrate for film formation. The friction coefficient of the copper oxide thin film can be controlled remarkably low.
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| 申请公布号 |
US7713635(B2) |
申请公布日期 |
2010.05.11 |
| 申请号 |
US20040554204 |
申请日期 |
2004.04.23 |
| 申请人 |
NATIONAL INSTITUTE FOR MATERIALS SCIENCE |
发明人 |
GOTO MASAHIRO;KASAHARA AKIRA;TOSA MASAHIRO;YOSHIHARA KAZUHIRO |
| 分类号 |
B32B9/00;C23C14/08;H05H1/24 |
主分类号 |
B32B9/00 |
| 代理机构 |
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