发明名称 |
METHOD AND DEVICE FOR REMOVING SOLDER MATERIAL DEPOSITS FROM A SUBSTRATE |
摘要 |
The invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is introduced into the covering having a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is arranged in an essentially sealing manner against the substrate. The solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is transversal to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.
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申请公布号 |
KR20100047847(A) |
申请公布日期 |
2010.05.10 |
申请号 |
KR20107001355 |
申请日期 |
2008.06.10 |
申请人 |
PAC TECH-PACKAGING TECHNOLOGIES GMBH |
发明人 |
AZDASHT GHASSEM |
分类号 |
B23K1/018;B23K3/02;B23K26/14;H05K13/04 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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