| 摘要 |
A solid-state imaging device (1) is provided with a light receiving section (10), a signal readout section (20), a control section (30) and a correction processing section (40). In the light receiving section (10), M8N pixel sections (P-P), which include a photodiode generating charges of a quantity corresponding to incoming light intensity, and a readout switch connected to the photodiode, are two-dimensionally arranged in M rows and N columns. The charges generated at each pixel section (P)are inputted to an integration circuit (S) through a readout wiring (L), and a voltage value outputted from the integration circuit (S) corresponding to the charge quantity is outputted to an output wiring (L) through a holding circuit (H). In a correction processing section (40), correction processing is performed for each of frame data repeatedly outputted from a signal readout section (20), and the frame data after the correction processing is outputted. |
