| 摘要 |
A solid-state imaging device (1) is provided with a light receiving section (10), a signal readout section (20), a control section (30) and a correction processing section (40). In the light receiving section (10), an M8N number of pixel sections (P-P) are two-dimensionally arranged in M rows and N columns. Each pixel section includes a photodiode which generates charges of a quantity corresponding to incoming light intensity, and a readout switch connected to the photodiode. Charges generated by each pixel section (P) are inputted to an integration circuit (S) through a readout wiring (L), and a voltage value outputted from the integration circuit (S) corresponding to the charge quantity is outputted to an outputting wiring (L) through a holding circuit (H). In the correction processing section (40), correction processing is performed to each frame data repeatedly outputted from the signal readout section (20), and the frame data after the correction processing is outputted.
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