MICROCHANNEL HEATSINK FOR SEMICONDUCTOR LASER DIODE ARRAY

摘要

PURPOSE: The micro channel heat sink for the array of semiconductor laser diode efficiently releases the heat since it circulates the cooling body to not only the first upper side but also the second upper side lower part. CONSTITUTION: An array of semiconductor laser diode(10) is adhered in the first upper side(115). An incline(117) is expanded from the upper side. An second upper side(119) lower than the first upper side is connected to incline. The array of semiconductor laser diode is adhered by using a sub mount(20) for the first upper side. The sub mount is proceed the role of reducing the deformation of the array of semiconductor laser diode and heat sink(110).