| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bump bonder in which an IC chip as thin as 0.1 mm or less can be sucked without causing any flexure or warp. SOLUTION: The bump bonder comprises a heat stage 22 for mounting an IC chip, a bonding head 23, and a carrier 26. The heat stage 22 comprises a suction hole 22a filled with a porous material 70, and a first vacuum suction mechanism 32 for sucking and holding the IC chip 1 on the heat stage 22. The carrier 26 comprises suction nozzle holes 51 and 52 each having a suction opening 55 filled with a porous material 63, and a second vacuum suction mechanism 58 for sucking and holding the IC chip 1.</p> |
