SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to simplify a manufacturing process by forming and stacking different connection units on the semiconductor package with the same structure through a stencil mask. CONSTITUTION: A first chip selection electrode(10) is arranged on a first row separated from an edge of an upper side of a semiconductor chip(5). The first chip selection electrode passes through the semiconductor chip. A second chip selection electrode(20) is arranged on the first row and is separated from the first chip selection electrode with a constant interval. The second chip selection electrode passes through the semiconductor chip. A third chip selection electrode(30) is arranged on a second row far away from the first row with the second chip selection electrode and passes through the semiconductor chip. A fourth chip selection electrode(40) is separated from the third chip selection electrode on the second row and passes through the semiconductor chip. A first rearrangement line(50) connects the first and third chip selection electrodes. A second rearrangement line(60) connects the second and fourth chip selection electrodes.