发明名称 |
Light-emitting diode assembly and method of fabrication |
摘要 |
An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.
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申请公布号 |
US7598535(B2) |
申请公布日期 |
2009.10.06 |
申请号 |
US20060309257 |
申请日期 |
2006.07.20 |
申请人 |
FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
HU TSENG-HSIANG;LIN YEU-LIH;TAN LI-KUANG |
分类号 |
H01L29/22;H01L23/10;H01L23/34;H01L23/495;H01L29/227;H01L33/00 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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