发明名称 |
Element substrate and method of manufacturing the same |
摘要 |
A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing a second support substrate on the first support substrate so that the metal layer is interposed between the first and second support substrates; pouring a resin material in a fluid state between the first and second support substrates; curing the resin material to form a resin substrate; and removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate.
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申请公布号 |
US7597813(B2) |
申请公布日期 |
2009.10.06 |
申请号 |
US20070906549 |
申请日期 |
2007.10.02 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KANEDA TOSHIHIKO;KIMURA SATOSHI;FURIHATA HIDEMICHI;KIJIMA TAKESHI |
分类号 |
H01B13/00;H01L21/302 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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