发明名称 Element substrate and method of manufacturing the same
摘要 A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing a second support substrate on the first support substrate so that the metal layer is interposed between the first and second support substrates; pouring a resin material in a fluid state between the first and second support substrates; curing the resin material to form a resin substrate; and removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate.
申请公布号 US7597813(B2) 申请公布日期 2009.10.06
申请号 US20070906549 申请日期 2007.10.02
申请人 SEIKO EPSON CORPORATION 发明人 KANEDA TOSHIHIKO;KIMURA SATOSHI;FURIHATA HIDEMICHI;KIJIMA TAKESHI
分类号 H01B13/00;H01L21/302 主分类号 H01B13/00
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