发明名称 |
Method for holding semiconductor wafer |
摘要 |
Provided is a method comprising: back grinding a back side or a semiconductor wafer W having a protective tape applied on the surface thereof leaving annularly an outer peripheral part un-ground; separating the protective tape from a surface of the semiconductor wafer W having an annular projected part formed in the outer peripheral part of the back side; applying a holding tape over the surface of the semiconductor wafer W from which the protective tape having been separated and a surface of a ring frame f; removing and separating the outer peripheral part in the semiconductor wafer applied and held on the holding tape, by annularly cutting; applying a dicing tape over the back side of the semiconductor wafer having been made flat and the back side of the ring frame; and separating the holding tape from the ring frame and the semiconductor wafer.
|
申请公布号 |
US7598120(B2) |
申请公布日期 |
2009.10.06 |
申请号 |
US20080114544 |
申请日期 |
2008.05.02 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
YAMAMOTO MASAYUKI;MORIMOTO KAZUO |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|