| 摘要 |
A semiconductor chip flipping assembly and an apparatus for bonding a semiconductor chip using the same are disclosed. In accordance with the semiconductor chip flipping assembly and the apparatus for bonding a semiconductor chip using the same, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.
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