发明名称 |
Semiconductor packages with enhanced joint reliability and methods of fabricating the same |
摘要 |
Provided is a semiconductor package with enhanced joint reliability and methods of fabricating the same. The method includes: forming package units including a semiconductor chip interposed between a bottom layer and a top layer; and sequentially stacking the package units on a substrate. The bottom layer and the top layer are formed of a material having a lower modulus than the semiconductor chip. The semiconductor package includes: at least one package unit disposed on a substrate, the package unit including a semiconductor chip having a pad, a bottom layer and a top layer substantially surrounding the semiconductor chip, and a redistribution structure overlying the top layer. The redistribution structure is electrically connected to the pad.
|
申请公布号 |
US7598607(B2) |
申请公布日期 |
2009.10.06 |
申请号 |
US20080123367 |
申请日期 |
2008.05.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHUNG HYUN-SOO;JANG DONG-HYEON;KIM NAM-SEOG;KANG SUN-WON |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|