发明名称 Semiconductor device and production method therefor
摘要 A semiconductor device, including: a semiconductor substrate of a first conductivity; and a semiconductor layer provided on the semiconductor substrate and having a super junction structure including drift layers of the first conductivity and RESURF layers of a second conductivity different from the first conductivity, the drift layers and the RESURF layers being laterally arranged in alternate relation parallel to the semiconductor substrate, the RESURF layers being each provided alongside an interior side wall of a trench penetrating through the semiconductor layer, the drift layers each having an isolation region present between the RESURF layer and the semiconductor substrate to prevent the RESURF layer from contacting the semiconductor substrate.
申请公布号 US7598586(B2) 申请公布日期 2009.10.06
申请号 US20040577361 申请日期 2004.12.24
申请人 ROHM CO., LTD. 发明人 TAKAISHI MASARU
分类号 H01L21/265;H01L29/72;H01L21/336;H01L29/06;H01L29/08;H01L29/40;H01L29/78 主分类号 H01L21/265
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