SURFACE TREATMENT METHOD OF COPPER FOIL FOR PRINTED CIRCUIT, COPPER FOIL AND ELECTROPLATER THEREOF

摘要

PURPOSE: A surface treating method of a copper foil of a printed circuit and a plating device thereof are provided to improve adhesive force between the copper foil for FPC and polyimide resin by forming a barrier layer including cobalt alloy on a copper nodule layer. CONSTITUTION: A surface treating method of a copper foil of a printed circuit comprises followings. A copper nodule layer is formed on the surface of a copper foil(S110). The copper foil has 2.0μm or less surface roughness. The bend count of the copper foil is more than 60 times. A barrier layer is made by plating cobalt or cobalt alloy on the copper nodule layer(S120).