发明名称 |
Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip |
摘要 |
A semiconductor chip (1), to which a layer sequence (2) intended for the production of a soldered connection has been applied. The layer sequence (2) comprises a solder layer (15) and an oxidation prevention layer (17), which follows the solder layer (15) as seen from the semiconductor chip (1). A barrier layer (16) is included between the solder layer (15) and the oxidation prevention layer (17). This prevents a constituent of the solder layer (15) from diffusing through the oxidation prevention layer (17) prior to the soldering operation, where it would effect oxidation that is disadvantageous for producing a soldered connection.
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申请公布号 |
US7598529(B2) |
申请公布日期 |
2009.10.06 |
申请号 |
US20060393533 |
申请日期 |
2006.03.30 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
PLOESSL ANDREAS;ILLEK STEFAN;GROLIER VINCENT |
分类号 |
H01L29/201;H01L33/62 |
主分类号 |
H01L29/201 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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