| 摘要 |
PURPOSE: An LED package using substrate with elevated platform is provided to concentrated position the fluorescent substance in the elevated platform. CONSTITUTION: The LED package using substrate includes the substrate(10), the elevated platform(20), the LED chip(30), and the light-transmissive encapsulating material(40). The elevated platform is protruded to the top surface of a substrate. The LED chip is mounted at the upper end of the elevated platform. The LED chip is positioned higher than the top surface of a substrate. The light-transmissive encapsulating material is formed in the upper side of a substrate by sealing the LED chip. |
