发明名称 |
A LEAD-FREE COPPER ALLOY AND ITS USE |
摘要 |
A lead-free copper alloy on the base of Cu-Zn-Si and its use. The copper alloy is built on the base of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities. The demands for a health-conscious and ecological compatibility are thus naturally met.
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申请公布号 |
CA2458723(C) |
申请公布日期 |
2009.10.06 |
申请号 |
CA20042458723 |
申请日期 |
2004.02.25 |
申请人 |
WIELAND-WERKE AG |
发明人 |
HOFMANN, UWE;DANNENMANN, WOLFGANG;BREU, MONIKA;BOEGEL, ANDREAS;SEEGER, JOERG;SCHMID, GUENTER |
分类号 |
C22C9/10;C22C9/04 |
主分类号 |
C22C9/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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